[KoMiCo Lab] Cleaning Technology Using Redox Reactions
In the semiconductor industry, various types of metallic contaminants are generated throughout the manufacturing process. These contaminants can have a direct impact on product yield and quality.
One of the most effective methods for removing such contaminants is chemical cleaning technology based on redox reactions. Today, it is widely used as a standard cleaning method in semiconductor component cleaning processes.
In this article, we will take a closer look at the principles and characteristics of chemical cleaning technology based on redox reactions.
■ What is a Redox Reaction?
- A redox (oxidation-reduction) reaction is an electrochemical process that involves the transfer of electrons between two substances. This reaction fundamentally operates based on the following mechanisms:
- Oxidation: A chemical reaction in which an atom or ion loses electrons.
- Reduction: A chemical reaction in which an atom, molecule, or ion gains electrons.
These two reactions always occur simultaneously, and the number of electrons lost by the oxidized substance is always equal to the number of electrons gained by the reduced substance. In the cleaning process, these redox reactions are utilized to ionize or decompose contaminants, thereby dissolving and effectively removing them.
Various types of metal contaminants generated during semiconductor manufacturing processes adhere to the surface of substrates, and even these microscopic impurities can have a direct impact on yield and product quality. To effectively remove such contaminants, redox reaction-based chemical cleaning technology is widely adopted across the semiconductor industry.
This cleaning technology leverages the chemical property differences between the substrate and the contaminants, allowing for highly selective reactions that target only the contaminants while preserving the integrity of the underlying material. Based on this principle, KoMiCo continuously develops and provides optimized cleaning processes tailored to the characteristics of different contaminants and substrate materials to meet the specific needs of our customers.
Representative examples of KoMiCo's proprietary redox-based cleaning technologies include Custrip™, Costrip™, Tistrip™, and SurFinish®, which are designed to effectively remove contaminants while minimizing substrate damage. These solutions are actively applied in the field and are being steadily expanded to meet the evolving demands of semiconductor manufacturing environments.
In the next article, we will take a closer look at cleaning technology based on dissolution. This method utilizes the principle that substances with similar polarity can dissolve each other. By applying chemicals with a polarity similar to that of the contaminant, the dissolution-based cleaning process enables efficient and selective removal.
We look forward to your continued interest and support in the upcoming post.
<About KoMiCo>
KoMiCo, established in 1996, was the first company in Korea to commercialize cleaning and coating services for semiconductor equipment components. With global operations spanning the United States, China, Taiwan, and Singapore, KoMiCo has earned quality certifications from some of the world’s leading semiconductor manufacturers, solidifying its position as a Global No.1 in the industry.
Building on its advanced cleaning and coating technologies, KoMiCo continues to enhance its core business while expanding into the development and supply of key OEM components for semiconductor equipment. Moving forward, the company remains committed to improving customers’ productivity and yield, and aims to become a global leader in the semiconductor component cleaning, coating, and manufacturing industry.
