[KoMiCo Lab] CO₂ Blasting Technology Combining Precision and Eco-Friendliness
In the semiconductor industry, component cleaning is not merely about contaminant removal—it represents a mission-critical process step that directly impacts device yield and overall process reliability. For components highly sensitive to electrostatic discharge (ESD) or precision, high-value equipment parts, advanced cleaning methodologies are required to achieve complete decontamination without inducing surface damage.
One of the representative technologies engineered to meet these stringent demands is CO₂ Blasting.
■ What is CO₂ Blasting?
CO₂ Blasting is a dry, non-contact cleaning process that employs solid carbon dioxide (CO₂), in the form of dry ice pellets, accelerated by high-pressure compressed air to dislodge surface contaminants. The dry ice pellets penetrate the interface between the substrate and contaminants, delivering localized impact energy. Upon sublimation, the CO₂ undergoes a rapid volumetric expansion, effectively lifting and separating thin films, organic residues, and fine particulates.
At ambient temperature, dry ice instantaneously sublimates into gaseous CO₂, expanding to over 800 times its original volume. The synergistic effect of this powerful expansion force and the kinetic impact energy enables precise removal of impurities while preserving the substrate’s structural and surface integrity.
The operating mechanism of CO₂ Blasting can be summarized as follows:
When dry ice pellets are accelerated through a nozzle with high-pressure compressed air, they collide with the target surface at high velocity. Upon impact, the pellets instantly sublimate by absorbing ambient thermal energy, inducing a rapid volumetric expansion and transient pressure differential. This combination of physical effects weakens the adhesion forces between the contaminant layer and the substrate, while the mechanical impulse from the impact further facilitates selective dislodgement of surface impurities.
Compared to conventional semiconductor cleaning techniques that rely on direct mechanical contact, CO₂ Blasting provides multiple advantages, leading to its increasing adoption across semiconductor manufacturing and precision component industries.
The most significant benefit lies in its ability to minimize substrate damage. Dry ice exhibits inherently low hardness and undergoes immediate sublimation at ambient conditions, ensuring that the substrate is not subjected to mechanical stress during cleaning. Consequently, even highly ESD-sensitive components can be safely cleaned without risk of micro-damage or latent reliability failures.
Additionally, CO₂ Blasting is inherently free from chemical solvents, eliminating concerns of secondary contamination. In conventional wet chemical cleaning, residual chemicals may re-deposit onto the substrate or necessitate costly wastewater treatment. By contrast, CO₂ naturally sublimates into gas after cleaning, leaving no solid or liquid waste streams, thereby reducing environmental impact and simplifying post-process handling.
Owing to these unique advantages, CO₂ Blasting is being widely applied for wafer cleaning, organic film removal, and particle decontamination in semiconductor processes. It is emerging as a next-generation eco-efficient cleaning solution for advanced device manufacturing.
In the next article, we will introduce ultrapure water-based wet cleaning technology, another critical methodology in semiconductor contamination control. Stay tuned for further insights.
<About KoMiCo>
KoMiCo, established in 1996, was the first company in Korea to commercialize cleaning and coating services for semiconductor equipment components. With global operations spanning the United States, China, Taiwan, and Singapore, KoMiCo has earned quality certifications from some of the world’s leading semiconductor manufacturers, solidifying its position as a Global No.1 in the industry.
Building on its advanced cleaning and coating technologies, KoMiCo continues to enhance its core business while expanding into the development and supply of key OEM components for semiconductor equipment. Moving forward, the company remains committed to improving customers’ productivity and yield, and aims to become a global leader in the semiconductor component cleaning, coating, and manufacturing industry.
